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Clean check of SMT Stencils optimizes solder paste printing
Provided by:Embedded Logic Solutions 5/09/2008 - The LPKF StencilCheck Software inspects SMT stencils for cleanliness to verify that each aperture is free of debris. Only an absolutely clean stencil ensures an entire and reliable paste release when printing. The inspection of the cleaning result saves time for test printings and is more reliable than a visual inspection. Based on a commercially approved PC – Scanner (which is not part of the delivery) the Software generates one optical scan of the SMT solder paste stencil. This scan will be compared against the CAD production data. Any impurities in the stencil will be shown directly on the PC. A full report can be printed and used for the QC management. News Articles
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