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BGA/CSP Rework and Repair - Pace TF-1700

Supplier: Solder Static

PACE’s ThermoFlo Systems (TF 1700E & TF 2700E) are the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success!


Price Guide: POA

Designed for today’s PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs.

The PC based software is so advanced that creating profiles has never been easier!

The PC software guides the operator through an intuitive interface that virtually automates the process.

All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement.

The PCB holders features fine micrometer adjustment for the most delicate X and Y axis alignments. Precise and accurate, within 25 µm (.001”), Z axis movement is ensured through a twin rail, linear bearing motion control assembly that is similar to those used on automated pick and place equipment.

The optic systems utilize advanced digital, color cameras and the highest quality prism available for amazing image clarity. ThermoFlo systems combine convective top-side heating with remarkably stable and powerful IR bottom-side heating for the most effective, repeatable heating process available today.

Both systems are self-contained and do not require an external air supply or vacuum connections. Upgrade your area rework capabilities and throughput with ThermoFlo!

Features and Specifications >>

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