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DEK Additive Stencils

Supplier: Hawker Richardson

Additive stencil technology from DEK enables variable deposit thickness to be achieved in a single pass, using an enclosed print head technique such as ProFlow® DirEKt Imaging.

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Traditional step-etch stencils display limitations, especially when used with an enclosed print head; as the enclosed wiper blade reaches the etched area, the seal between blade and stencil is broken.

Additive stencils, by contrast, are enhanced in the areas that require thicker deposits.

This characteristic is better suited to direct imaging, but DEK has gone further, developing a technique for creating ride-on/ride-off edges to the enhanced areas.

Conditioning the built-up edges in this way eliminates damage to metal squeegees and enclosed wiper blades, and enhances longevity of the stencil and printing equipment.

Deposit thickness can be enhanced between 10 and 100 microns by building up selected areas on the surface of the stencil.

Additive pads can be positioned per component for maximum control over individual deposit thickness anywhere on the board.

Exploiting DEK's unique understanding of the screen printing process, additive pad technology can be applied to the squeegee side or board side of the stencil, depending on application requirements.

It is also possible to enhance assigned areas on both sides of the stencil if required.

  • Technique compatible with enclosed head and squeegee-based printing
  • Base foil thickness optimised for typically 95% of components
  • Thicker deposits enabled by increasing thickness in selected areas
  • Enhance deposits by upto 100 microns
  • Satisfies requirements for individual components
  • Technique applicable to squeegee side, board side or both sides+

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