Tresky DIE Bonder T3000-PRO
Manual Bonder with semi auto. process capabilities
The T-3000-PRO series is Tresky’s most flexible die bonding platform.
The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
As with all of Tresky’s products, the T-3000-PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
Application Packages:
To contact ONBoard Solutions about Tresky DIE Bonder T3000-PRO use Get a quote.
Manual Bonder with semi auto. process capabilities
The T-3000-PRO series is Tresky’s most flexible die bonding platform.
The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
As with all of Tresky’s products, the T-3000-PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
Application Packages:
To contact ONBoard Solutions about Tresky DIE Bonder T3000-PRO use Get a quote.
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