Australia's #1 industrial directory for equipment & suppliers

Electronics Encapsulation

Supplier: Tarapath

Macromelt Low pressure moulding is a process that sits between conventional injection moulding and two-part potting processes.

CONTACT THIS SUPPLIER TO FIND OUT MORE

The process can be used to protect sensitive electronics from environmental factors such as moisture, dust and vibration.

The safe and clean one step process can replace traditional potting techniques, while the moulding process allows flexibility in design of custom parts for individual applications.

With Macromelt permanent bonding between two substrates can be achieved.

Often the process enables the elimination of other plastic parts such as enclosures, back shells, or grommets which can prove to be highly economical.

CONTACT THIS SUPPLIER TO FIND OUT MORE

Showcase your business!

Connect with 600,000 industrial buyers annually

Learn more