Huntsman’s PU technologies for skin, backfoaming and carriers are used by the most demanding OEMs to make tough, lightweight and aesthetically pleasing door panels.
Our LD RIM carrier technology provides a low density, glass-free, no-filler alternative to reinforced R-RIM carriers. LD RIM processing requires none of the elaborate, capital intensive equipment needed for glass fiber processing.
Moreover, while the LD RIM processing is simplified, the result is equal or superior to standard, glass fiber-reinforced door panels, with excellent impact resistance and modularity.
- Simplified processing
- Impact resistance