Advance's unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of ICs.
Key applications of the technology include:
- Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR.
- Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces
- Cross-sectioning of die and package-level devices
Along with ULTRA TEC's signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.
Fast and convenient sample movement between polisher and microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die – a huge improvement over earlier generation polishers.
The ULTRAPOL Advance Lapping Machine system allows recirculating slurry polishing (key for many de-layering operations) as well as standard faucet coolant.
For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power polish' mode is incorporated that rotates the sample during processing.
Full equipment solutions start from under $18,000.
For more information or a qoute on the ULTRAPOL Advance Lapping and Polishing Machine please call or email for a direct reply.