This next-generation memory test system for evaluation, analysis and volume production offers significantly improved cost performance and is suitable for conducting package tests for many kinds of memory devices.
Features of Memory Test System MT6121 (For Package Test Process):
- High Cost Performance · Simultaneous Testing of Two Device Types: In a single test head configuration, parallel measurement of up to 512 memory devices is possible. In a double test head configuration, throughput is drastically improved as the test heads operate independently and can simultaneously test two different device types.
- Package Testing for All Memory Device Types - For DRAM, SRAM, PSRAM, Flash, MCP (Multi Chip Package) and ASIC with memory. For wafer and KGD (Known Good Die) tests
- Reduced Footprint - Thanks to its newly developed multi-function test station, the MT6121 uses just 60% the floor space of previous Yokogawa testers.
- User Friendly - The AViPS™ user interface reduces both development and evaluation time.