Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in one compact safety housing.
The board is passed through six baths of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards.
The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). It offers a subsequent tin bath step for surface protection and improved solderability
Optimized anode plate and pulse reverse plating ensure homogeneous deposition, and carbon activation using black hole technology, integrated air blow-in, and an additional process step for via cleaning ensure reliable connections to the copper surface without the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate.
The integrated touch panel with wizard safely guides even inexperienced users through the galvanization process. The process requires no knowledge of chemistry as the system automatically indicates the necessary maintenance steps.
|Max. material size (X x Y)||230 mm x 330 mm (9” x 13”)|
|Max. layout area (X x Y)||200 mm x 300 mm (7.8” x 11.8”)|
|Reversing pulse plating||Adjustable|
|Tolerance||± 2 µm (plated copper)|
|Minimum hole diameter||≥ 0,2 mm|
|Process time||Approx. 90 - 120 min|
|Electrical consumption||115 / 230 V, 50 - 60 Hz, 0,6 kW|
|Dimensions (W x H x D)||856 mm x 446 mm x 542 mm (33.7” x 17.5” x 21.3”)|
|Weight||~ 80 kg unfilled, ~ 115 kg filled|
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