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Semiconductor Packaging StenSEAL

Supplier: Hawker Richardson playlist_addCompare


Price Guide (Inc GST): POA

Stencil Applied Overmold K&S and DEK are developing a low-cost, high-volume alternative to injection molding and dispensing processes, by combining their expertise in liquid encapsulant compounds and high accuracy mass imaging technologies.

StenSEAL is a single component, silica-filled, liquid encapsulant, formulated to provide a smooth-surface, void-free, molded package appearance when applied using DEK's patented ProFlow® DirEKt Imaging.

StenSEAL is ideal for one-up or array type laminate packages that may require a short time to market.

Its ability to be applied through a stencil allows high productivity and design flexibility, along with reduced capital, tooling and maintenance costs in comparison to injection molding.

Because package thickness can be controlled very precisely as a function of stencil thickness, StenSEAL is an excellent choice for very thin packages.

Its cured properties allow it to be used on thin, fragile substrates (such as LTCC) that cannot withstand even low amounts of stress.

Key to the application of StenSEAL Overmold is the use of DEK's patented ProFlow® high accuracy, mass imaging technology.

The ProFlow® transfer head is fitted with a cassette filled with overmold, and applies a userdefined pressure that forces the overmold through the transfer head to fill the stencil apertures.

Specially coated blades create a firm gasket seal between the stencil and substrate, which ensures high repeatability and enables a good surface finish.

Because ProFlow® retains the overmold compound inside the transfer head and off the stencil surface, material waste is also minimized.

When excursion speed and transfer pressure are optimized, the process produces smooth, void-free application in normal atmospheric conditions without the need for vacuum.

Contact DEK for more information regarding this product.