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Silicon Pressure Sensor Dies and Chips - By BCM

Supplier: Bestech Australia

Despite their small size, BCM's silicon chip dies have a high level of performance. BCM offers a wide array of different pressure and acceleration sensor dies.

Price Guide: POA

The SE101 is for absolute pressure measurement and manufactured in a silicon-silicon structure through MEMS technology. It is only 1mm in diameter, and features pressure ranges of 0-1 bar to 0-35 bar (absolute). This model is suitable for many low cost and high performance OEM applications, including tyre pressure monitoring and engine control, use in consumer electronics or use as an industrial pressure sensor.

The SE103 pressure sensor dies are made from high quality silicon wafer on glass through a 4” MEMS process. These can be in gauge or absolute pressure form, and pressure ranges vary from 0-200 mbarG up to 0-1000 barA.

The SE105 is a multifunctional pressure sensor die on which there are two independent Wheatstone bridge circuits to measure static pressure as well as the differential pressure in an industrial process. These pressure sensor chips are constructed similar to the SE103. Differential pressure ranges of 0-400 mbar to 0-10 bar are available, with static pressure up to 160 bar. These are used typically for air and mass flow measurements in industrial processes.

Due to the MEMS technology used in these pressure sensor chips, the pressure membranes of these sensors possess high sensitivity and high overload pressure capability. The accuracies of these chips are very good, between 0.25% and 0.5% FS.

Also available from Bestech Australia is the SE107 single axis accelerometer die. Using a differential capacitive working principle, these accelerometer dies also have silicon on glass structure and are made from high quality silicon wafers using MEMS processes. The use of capacitive technology results in low stress effects and the effect of temperature is minimised. These accelerometer chips can measure up to ±2g.