In combination with improved bottom-side cooling, the new package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or enhanced SO-8 packages.
This effectively doubles current density (A/in2) at a lower total system cost. The DirectFET MOSFET family offerings match 20V and 30V synchronous buck converter MOSFET chipsets, followed by the addition at 30V targeted for high frequency operation.
The DirectFET MOSFET family is also available in three different can sizes giving maximum flexibility for all your design needs.
FEATURES AT A GLANCE
- RoHs compliant containing no lead or bromide
- Not all DirectFET MOSFETs are Qualified for use with lead-free solder; see PbF Qualification pages to determine part status.
- 1.4°C/W junction to case thermal resistance (Rth(J-C)) enables highly effective top-side cooling
- Less than 1°C/W Rth(junction-pcb) in same footprint as SO-8
- Over 90% lower die-free package resistance (DFPR) than SO-8
- 0.7mm profile compared to 1.75mm for SO-8
- Direct chip attach with no wire bonding or lead-frame
- Lower package inductance for higher frequencies
- Compatible with high volume manufacturing equipment and processes
THE IR ADVANTAGE
- Increases current density by a factor of two
- Cuts MOSFET part count by 60%
- Reduces PCB space by 50%
- Up to 50°C lower operating temperature increases reliability
- Lower total system cost
- VRM modules for Servers (sync buck)
- Workstations and mainframes (sync rectification, ORing)
- High-performance notebooks (sync buck)
- Advanced telecom and datacom systems (bus converter)
- Radio controlled toys (motor control)
- Battery operated tools (motor control)
- Class D audio