By improving the heat reduction the device will have improved life cycle, hence improved product reliability. To ensure good thermal conductivity, thermal interface materials (TIM’s) are needed between the device and the heat sink or enclosure. JHC has thermal solutions that meet these needs for today's requirements.
Therm-A-gap is a TIM that is designed to fill air gaps between two uneven surfaces and ensure a good thermal transfer. It has a low deflection force so PCBs and components are not under mechanical stress.
It is available in a wide range of thicknesses from 0.254mm to 5.08mm. Fibreglass carriers are available for electrical insulating cases and an alu- minium carrier version is available with a high strength acrylic pressure sensitive adhesive (PSA) on it.
It can also be die cut to specific shapes to make assembly easier.