The T-4909 is a manual, high-quality die bonder with a superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909, they developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder, this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
Application Packages:
