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Ultra-small Rugged Computer-On-Module | MEN MM2

Supplier: OEM Technology Solutions

The MM2 is an ultra-small Computer-On-Module of the rugged ESMini™ family, together with an application specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission-critical environments.

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Main Features of the MEN MM2 Ultra-small Rugged Computer-On-Module:
  • Intel® Atom™ E600 series, up to 1.6 GHz
  • Up to 2 GB DDR2 SDRAM
  • 2 PCI Express®
  • 2 Gb Ethernet interfaces
  • 6 USB 2.0 hosts and 1 USB 2.0 client
  • 4 UARTs
  • 1 CAN bus interface
  • SDVO, LVDS
  • Intel® HD audio
  • 2 SATA ports
  • -40°C to +85°C Tcase (screened or with qualified components)
  • Conduction cooling

The MM2 is an ultra-small Computer-On-Module of the rugged ESMini™ family. Together with an application-specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission-critical environments.

The small form factor board is controlled by an Intel® Atom™ processor from the E6xx series. This processor family offers high I/O flexibility as it uses the PCI Express® standard for the processor-to-chipset interface. The MM2 has a total power consumption of max. 5 to 7 W, while having a clock frequency of up to 1.6 GHz.

The MM2 accommodates up to 2 GB of directly soldered main memory. Different mass storage media are supported on the carrier board.

The MM2 offers a multitude of I/O: besides modern serial I/O like two PCI Express® x1 links, LVDS, SDVO, high-definition audio, SATA and USB, it also provides legacy I/O (1 CAN, 4 COM, 2 I2C).

The MM2 is completed by a board management controller for temperature and power supervision. It comes with a UEFI BIOS. The MM2 is screened for operation in a -40°C to +85°C temperature range (Tcase at the cover and frame). As all ESMini™ modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling.

Air cooling is also possible by applying a heat sink on top of the cover. Where operating temperatures are moderate, the module may even do without the frame and cover, with a suitable low-power processor and airflow. ESMini™ modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. The MM2 supports a 95x55mm form factor.

For evaluation and development purposes a microATX carrier board is available.

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