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Ultra-Small Rugged Computer-On-Module | MEN

Supplier: OEM Technology Solutions

The MM1 is an ultra-small computer-on-module of the rugged ESMini™ family, together with an application specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission critical environments.

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Features of the MEN Ultra-Small Rugged Computer-On-Module:

  • Intel® Atom™ Z530 or Z510, up to 1.6 GHz
  • Up to 1 GB DDR2 SDRAM
  • 1 PCI Express®
  • Up to 2 Fast Ethernet interfaces
  • 8 USB 2.0 (1 client)
  • 2 UARTs
  • Up to 2 CAN bus interfaces
  • SDVO, LVDS
  • Intel® HD Audio
  • -40°C to +85°C screened
  • Conductive cooling

The MM1 is controlled by the Intel® Atom™ processor, a first generation IA-32 core based on 45nm process technology. Due to the new power architecture of the Intel® Atom™ processor, the MM1 has a total power consumption of max. 5 to 7 Watts, while having a clock frequency of 1.1 GHz.

The MM1 accommodates up to 1 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

The MM1 offers a multitude of I/O: besides modern serial I/O like one PCI Express® x1 link, LVDS, SDVO, high-definition audio, SATA and USB, it also provides legacy I/O (2 CAN, 2 COM, 2 Fast Ethernet, 2 I2C) and up to 120 GPIOs.

The MM1 is completed by a board management controller for temperature and power supervision. It comes with a Phoenix® Award BIOS configurable for the final application.

The MM1 is screened for operation in a -40°C to +85°C conduction or convection cooled environment. As all ESMini™ modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover.

Where operation temperatures are moderate, the module may even do without the frame and cover, with a suitable low-power processor and airflow. ESMini™ modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimised for conformal coating. ESMini™ modules support a 95x55mm form factor.

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