In addition the BondaScope 3100 incorporates all of the features above including the Resonance Impedance Plane Mode, adding an adjustable, Hi-Energy fixed frequency Mechanical Impedance Analysis Mode (MIA) as well as a Swept Frequency MIA (SweepMI) Mode bringing the MIA mode to a more useful and interpretive purpose.
Another mode specific to the BondaScope 3100 is the High-Energy, Swept Frequency Pitch-Catch Mode. The modes above can be presented in NDT Systems exclusive Real Time, Bond Profile Mode.
Dimensions of the BondaScope 3100 are 8.9" Tall x 5.75" Wide x 2.45 Deep and operates up to 9 hours on one Li-Ion Smart Battery Pack. Probes connect via an 11 pin Fischer Connector and are available from NDT Systems incorporating our Probe Recognition Technology (simplifying initial setups) or use probes of other manufacture directly, if desired potentially offering a significant savings in total cost of ownership.
Newly released is the newest addition to an array of innovative bond testers for composite inspection, the BondHub Imaging Bond Tester. Engineered with fully automatic C-scan imaging capability, this world's pioneer multimode imaging bond testing equipment optimizes the conventional inspection of composite materials and adhesively bonded structures.
The BondHub is fully compatible to the Bondascope 3100, manual and automatic scanners, as well as other leading edge bond testers, the BondHub imaging system takes non-destructive composite inspection to the next level.