Chomerics has strengthened its position as the market leader in electrically conductive form-in-place (FIP) gaskets with the addition of several new materials to its existing range. The materials on offer provide specifications to satisfy a broad range of consumer, industrial, and military / aerospace applications.
Dispensed, electrically conductive FIP gaskets provide the lowest total cost of ownership for small cross-section and complex pattern applications. Chomerics FIP materials can reduce the installed cost of an EMI gasket by up to 60%. Corrosion resistance provides protection against galvanic activity and may, in many applications, eliminate the need for Ni or Sn plating and / or secondary environmental gaskets.
Among the new materials are CHOFORM® 1122V, CHOFORM® 5550, and CHOFORM® 5545. All are single component, silicone-based materials that are designed to cure-in-place once applied to customer enclosures or castings.
All of Chomerics FIP materials meet UL 94V-0 flammability requirements.
EMI Shielding, Thermal Management and Optical Enhancement Products
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