TARAPATH - Low Pressure Electronics Encapsulation Get latest price

The process can be used to protect sensitive electronics from environmental factors such as moisture, dust and vibration.

The safe and clean one step process can replace traditional potting techniques, while the moulding process allows flexibility in design of custom parts for individual applications.

With Macromelt permanent bonding between two substrates can be achieved.

Often the process enables the elimination of other plastic parts such as enclosures, back shells, or grommets which can prove to be highly economical. 

Other benefits include protecting electronics and being environmentally friendly.

To contact Tarapath about TARAPATH Low Pressure Electronics Encapsulation use Get a quote.

The process can be used to protect sensitive electronics from environmental factors such as moisture, dust and vibration.

The safe and clean one step process can replace traditional potting techniques, while the moulding process allows flexibility in design of custom parts for individual applications.

With Macromelt permanent bonding between two substrates can be achieved.

Often the process enables the elimination of other plastic parts such as enclosures, back shells, or grommets which can prove to be highly economical. 

Other benefits include protecting electronics and being environmentally friendly.

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To contact Tarapath about TARAPATH Low Pressure Electronics Encapsulation use Get a quote.