Low Pressure Electronics Encapsulation
Macromelt Low pressure moulding is a process that sits between conventional injection moulding and two-part potting processes.
The process can be used to protect sensitive electronics from environmental factors such as moisture, dust and vibration. The safe and clean one step process can replace traditional potting techniques, while the moulding process allows flexibility in design of custom parts for individual applications. With Macromelt permanent bonding between two substrates can be achieved. Often the process enables the elimination of other plastic parts such as enclosures, back shells, or grommets which can prove to be highly economical.
Other benefits include protecting electronics and being environmentally friendly.
Low Pressure Gauge | LP-63mm
Low Pressure Ball Valve
Low Pressure Filtration
BTE5000 Low Pressure Transmitters
Low Pressure Moulding Adhesives | Macromelt
High Precision Pressure Calibrator | Martel Electronics BetaGauge 321
Low Pressure Hand Pump | MECP100
Low Pressure Pilot Operated Valves
CTE / CTU7000 Low Pressure Transmitters
Hydraulic Filter | Low Pressure Inline
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