Name: MEK PowerSpector BTL | Bottom-Side PCB AOI Inspection System
Price: 472500 AUD
Availability: InStock

Dedicated bottom-side inspection

Specification	Value
Model	MEK PowerSpector BTL
System type	Automated Optical Inspection (AOI)
Interface	SMEMA

Dedicated underside PCB inspection following reflow, wave, or selective soldering, optimised for post-wave and post-reflow processes.
Multi-angle camera array for full coverage of bottom-side components and solder joints.
Supports mixed-technology boards with SMT and THT bottom-side joints, including wave-soldered through-hole assemblies and double-sided SMT boards.
Detects bridging, insufficient solder, missing components and lifted leads.
Detects wave soldering defects including solder bridges, icicles, insufficient fill in through-hole joints and skipped joints.
Identifies missing parts, polarity errors and gross positioning defects in bottom-side SMT components following double-sided board reflow.
Provides bottom-side inspection as a final quality gate before the product reaches the customer.

Inline conveyor integration with SMEMA interface, without interrupting production flow.
Compatible with MEK Catch traceability and SPC reporting.
Configurable and programmable to match specific process requirements, scaling from small-batch laboratory operations to high-volume continuous production environments.
Intuitive operator interface.
Programmable process parameters with recipe storage.
Standard data output interfaces for process monitoring, statistical reporting and traceability.

Robust mechanical and electrical construction for extended service life.
Comprehensive safety interlocks and alarm functions.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.

Specification	Value
Model	MEK PowerSpector BTL
System type	Automated Optical Inspection (AOI)
Interface	SMEMA

Dedicated underside PCB inspection following reflow, wave, or selective soldering, optimised for post-wave and post-reflow processes.
Multi-angle camera array for full coverage of bottom-side components and solder joints.
Supports mixed-technology boards with SMT and THT bottom-side joints, including wave-soldered through-hole assemblies and double-sided SMT boards.
Detects bridging, insufficient solder, missing components and lifted leads.
Detects wave soldering defects including solder bridges, icicles, insufficient fill in through-hole joints and skipped joints.
Identifies missing parts, polarity errors and gross positioning defects in bottom-side SMT components following double-sided board reflow.
Provides bottom-side inspection as a final quality gate before the product reaches the customer.

Inline conveyor integration with SMEMA interface, without interrupting production flow.
Compatible with MEK Catch traceability and SPC reporting.
Configurable and programmable to match specific process requirements, scaling from small-batch laboratory operations to high-volume continuous production environments.
Intuitive operator interface.
Programmable process parameters with recipe storage.
Standard data output interfaces for process monitoring, statistical reporting and traceability.

Robust mechanical and electrical construction for extended service life.
Comprehensive safety interlocks and alarm functions.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.