Name: MEK VeriSpector | Through-Hole AOI Inspection System
Price: 472500 AUD
Availability: InStock

Dedicated THT inspection

Specification	Value
Model	MEK VeriSpector
Interface	SMEMA

Automated optical inspection of through-hole technology (THT) PCB boards and mixed-technology assemblies after wave soldering or selective soldering.
Optimised for the post-wave soldering inspection station to reduce rework and improve first-pass yield.
Dual-camera configuration verifies top-side component insertion quality and underside solder joint quality in a single machine pass.
Detects insertion errors, missing components, incorrect value, incorrect orientation, bent leads and component positioning errors.
Inspects solder joints for bridges, icicles, insufficient fill and cold joints.
Supports through-hole components from large connectors to fine-pitch ICs in DIP packages.
Inline conveyor-compatible.
Full reporting and data export for traceability and quality records.

Configurable and programmable to match specific process requirements, from small-batch laboratory operations to high-volume continuous production environments.
Robust mechanical and electrical construction for extended service life.
Intuitive operator interface.
Programmable process parameters with recipe storage.
Comprehensive safety interlocks and alarm functions.
Standard data output interfaces for process monitoring, statistical reporting and traceability.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.

Specification	Value
Model	MEK VeriSpector
Interface	SMEMA

Automated optical inspection of through-hole technology (THT) PCB boards and mixed-technology assemblies after wave soldering or selective soldering.
Optimised for the post-wave soldering inspection station to reduce rework and improve first-pass yield.
Dual-camera configuration verifies top-side component insertion quality and underside solder joint quality in a single machine pass.
Detects insertion errors, missing components, incorrect value, incorrect orientation, bent leads and component positioning errors.
Inspects solder joints for bridges, icicles, insufficient fill and cold joints.
Supports through-hole components from large connectors to fine-pitch ICs in DIP packages.
Inline conveyor-compatible.
Full reporting and data export for traceability and quality records.

Configurable and programmable to match specific process requirements, from small-batch laboratory operations to high-volume continuous production environments.
Robust mechanical and electrical construction for extended service life.
Intuitive operator interface.
Programmable process parameters with recipe storage.
Comprehensive safety interlocks and alarm functions.
Standard data output interfaces for process monitoring, statistical reporting and traceability.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.