Name: MEK ISO-Spector S3 | 3D Solder Paste Inspection System
Price: 472500 AUD
Availability: InStock

Full 3D measurement

Specification	Value
Model	ISO-Spector S3

Precision 3D Solder Paste Inspection (SPI) detects and measures solder paste printing defects before PCBs enter the reflow oven.
Full 3D measurement of solder paste deposits: volume, height, area, and offset.
Phase-shift structured light technology for micron-level precision.
Inline design for integration directly after the screen printer.
Detects bridging, insufficient paste, excess paste, missing deposits, smearing, misalignment and deposit shape variations immediately after printing.
Fast measurement cycle matched to high-volume SMT line speeds.

Outputs real-time SPC data and provides closed-loop SPC feedback to compatible screen printers for automatic process correction.
Automatically communicates corrective adjustments when paste offset trends are detected, keeping the paste process within control limits without operator intervention.
Configurable and programmable to match specific process requirements.
Programmable process parameters with recipe storage.
Standard data output interfaces for process monitoring, statistical reporting and traceability.

Robust mechanical and electrical construction for extended service life.
Intuitive operator interface.
Comprehensive safety interlocks and alarm functions.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.

Electronics manufacturing, semiconductor processing, precision industrial production, scientific research and development, and specialised manufacturing processes.
Scales from small-batch laboratory operations to high-volume continuous production environments.

Specification	Value
Model	ISO-Spector S3

Precision 3D Solder Paste Inspection (SPI) detects and measures solder paste printing defects before PCBs enter the reflow oven.
Full 3D measurement of solder paste deposits: volume, height, area, and offset.
Phase-shift structured light technology for micron-level precision.
Inline design for integration directly after the screen printer.
Detects bridging, insufficient paste, excess paste, missing deposits, smearing, misalignment and deposit shape variations immediately after printing.
Fast measurement cycle matched to high-volume SMT line speeds.

Outputs real-time SPC data and provides closed-loop SPC feedback to compatible screen printers for automatic process correction.
Automatically communicates corrective adjustments when paste offset trends are detected, keeping the paste process within control limits without operator intervention.
Configurable and programmable to match specific process requirements.
Programmable process parameters with recipe storage.
Standard data output interfaces for process monitoring, statistical reporting and traceability.

Robust mechanical and electrical construction for extended service life.
Intuitive operator interface.
Comprehensive safety interlocks and alarm functions.
Service access designed to minimise planned maintenance downtime and enable rapid fault diagnosis.

Electronics manufacturing, semiconductor processing, precision industrial production, scientific research and development, and specialised manufacturing processes.
Scales from small-batch laboratory operations to high-volume continuous production environments.

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