Name: MEK PowerSpector JSAz | High-Speed Selective 3D AOI System
Price: 472500 AUD
Availability: InStock

Specification	Value
Model	PowerSpector JSAz
Interface	Standard SMEMA

Selective 3D inspection with full-board 2D AOI in a single inline pass.
High-speed inspection optimised for high-volume SMT lines, with throughput speeds matching even the fastest SMT production lines.
Advanced structured light 3D measurement alongside multi-angle 2D imaging and advanced LED illumination.
Targeted 3D measurement of critical PCB component areas and solder joints, rather than every point on the PCB surface.
3D height measurement for solder volume and component coplanarity.
Intelligent false-call reduction algorithms.
Full SPC reporting and real-time process feedback.

Integrates with the MEK Catch traceability system, feeding per-board inspection results into a centralised database for full production traceability.
Standard SMEMA interface provides drop-in compatibility with existing SMT line infrastructure.
Standard data output interfaces support process monitoring, statistical reporting and traceability.

Configurable and programmable to match specific process requirements, scaling from small-batch laboratory operations to high-volume continuous production environments.
Programmable process parameters with recipe storage.
Intuitive operator interface.
Robust mechanical and electrical construction for extended service life.
Comprehensive safety interlocks and alarm functions.
Designed-in service access to minimise planned maintenance downtime and enable rapid fault diagnosis.

Specification	Value
Model	PowerSpector JSAz
Interface	Standard SMEMA

Selective 3D inspection with full-board 2D AOI in a single inline pass.
High-speed inspection optimised for high-volume SMT lines, with throughput speeds matching even the fastest SMT production lines.
Advanced structured light 3D measurement alongside multi-angle 2D imaging and advanced LED illumination.
Targeted 3D measurement of critical PCB component areas and solder joints, rather than every point on the PCB surface.
3D height measurement for solder volume and component coplanarity.
Intelligent false-call reduction algorithms.
Full SPC reporting and real-time process feedback.

Integrates with the MEK Catch traceability system, feeding per-board inspection results into a centralised database for full production traceability.
Standard SMEMA interface provides drop-in compatibility with existing SMT line infrastructure.
Standard data output interfaces support process monitoring, statistical reporting and traceability.

Configurable and programmable to match specific process requirements, scaling from small-batch laboratory operations to high-volume continuous production environments.
Programmable process parameters with recipe storage.
Intuitive operator interface.
Robust mechanical and electrical construction for extended service life.
Comprehensive safety interlocks and alarm functions.
Designed-in service access to minimise planned maintenance downtime and enable rapid fault diagnosis.