Unicomp | X-Ray Inspection Machine | AX-8200

This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 addresses both small and large volume factory requirements.

Applications

• Electronics inspection including BGA , CSP , QFN, Flip Chip, COB and wide range of SMT components
• Semiconductors
• Small metal casting
• Battery industry
• Electronic connector module
• Aerospace components
• Photovoltaic industry

 Key Features

• 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera
• 90KV 5μm X-ray tube, image intensifier with 2 mega pixel digital camera
• Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement
• Multi-function DXI image processing system
• X/Y programming function for multiple image inspection routines. Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification
• BGA void/area auto-measurement plus report generation