New Models of the RIFTEK 2D Laser Scanners for precise measurement of objects placed at large distance from the sensor as well as high precision measurement with micron accuracy. The Riftek models include the RF625-1050/165-85/100 and the RF625-17/6-7/8.
The first new model RF625-1050/165-85/100 has a sufficiently large base and a small range. It is intended for use in conditions when it is necessary to make a high precision measurement of objects placed at a large distance from the sensor (it may be caused by restricted space or high surround temperature). The scanner is equipped with air cooling system and air knives for window protection by default.
Scanner size: 598x54x216 mm, weight: 3 600 g.
The second model RF625-17/6-7/8 is intended for a high precision measurement with micron accuracy (it is twice better than for standard ones, namely 0.05% of the Z range).
Scanner size: 122x52x104 mm, weight: 590 g.
Both scanners can be equipped with RED (660 nm) or BLUE (450 nm or 405 nm) lasers.
Other 2D lasers include the standard, 2D laser scanner RF625. The laser scanners are designed for non-contact operation, measuring and checking of surface profile, dimensions, sorting and sensing of technological objects and 3D models construction.
The operation of the scanners is based on the principle of optical triangulation.
Radiation of a semiconductor laser is formed by a lens in a line and projected to an object. Radiation scattered from the object is collected by the lens and directed to a two-dimensional CMOS image sensor. The image of object outline thus formed is analyzed by a signal processor, which calculates the distance to the object (Z-coordinate) for each point of the set along the laser line on the object (X-coordinate). Scanners are characterized by base distance (beginning of the range), SMR, for Z-coordinate, measuring range (MR) for Z-coordinate, measuring range for X-coordinate at the beginning of Z (Xsmr) and measuring range for X-coordinate at the end of Z (Xemr).
High precision non-contact measurements include measuring profiles, dimensions, recognition, and control.
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